The **ATS-07A-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and attachment method. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Fin Style** | Straight (High Performance) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | Push-Pin (Brass or Plastic) | | **Thermal Resistance** | ~6.77°C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Components & Construction #### A. The Fin Array (Straight Fin) This model uses a **Straight Fin** design. These are optimized for "longitudinal" airflow, meaning they work best when air is forced through the channels between the fins. The 30mm height provides a large surface area for heat transfer. #### B. Push-Pin Attachment Instead of using messy thermal epoxy or complex brackets, this part uses the **pushPIN™** system: * It features a flexible spring-loaded mechanism. * It ensures consistent pressure across the component surface for maximum thermal conductivity. * The pins are designed for specific hole patterns on a PCB. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the specific TIM used. * **T412:** This is a high-performance thermal pad pre-applied to the base of the heat sink. It fills microscopic air gaps between the heat sink and the electronic chip to improve heat flow. --- ### 3. Applications The ATS-07A-101-C3-R0 is typically used in environments where active cooling (fans) is present: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial PCs:** Compact systems requiring robust cooling. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. 4. **Embedded Systems:** High-speed processors that generate significant localized heat. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.77 | | 300 | 1.5 | 2.45 | | 500 | 2.5 | 1.70 | ---