ATS-07A-124-C2-R0
AI

The **ATS-07A-124-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed primarily for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
The part number provides specific details about its dimensions, material, and thermal properties.
| Specification | Details |
| :--- | :--- |
| **Product Category** | Heat Sink (Passive Cooling) |
| **Material** | Aluminum (Anodized Blue) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.18°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Electronic Features
#### A. Thermal Resistance Efficiency
The device is engineered to dissipate heat effectively from the semiconductor package to the ambient air. With a thermal resistance of **3.18°C/W** at low airflow, it prevents thermal throttling in sensitive electronics.
#### B. pushPIN™ Attachment System
The "R0" suffix indicates the mounting hardware. This system uses a flexible, spring-loaded mechanism that:
* Ensures consistent pressure across the component surface.
* Simplifies installation on PCBs with pre-drilled holes.
* Reduces the risk of mechanical stress on the silicon die.
#### C. Material and Coating
* **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity.
* **Blue Anodization:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer.
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### 3. Application Use Cases
This specific heat sink is typically found in:
1. **Networking Hardware:** High-speed routers and switches.
2. **Industrial PCs:** Embedded systems requiring reliable passive cooling.
3. **Power Supplies:** Cooling MOSFETs or power regulators.
---
### 4. Part Number Breakdown
```text
ATS - 07 A - 124 - C2 - R0
| | | | |
| | | | └─ Attachment/Hardware (pushPIN)
| | | └─ Thermal Interface Material (T766)
| | └─ Height/Specific Series Designator
| └─ Fin Style/Specific Geometry
└─ Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the difference between active and passive cooling for this heat sink?
- ⤷ How do I calculate if the 3.18°C/W thermal resistance is sufficient for my CPU?
- ⤷ What are the PCB hole requirements for the pushPIN attachment system?