The **ATS-07A-166-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** family, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat-density integrated circuits. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Fin Type** | Straight / Square | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM | | **Overall Dimensions** | 25mm x 25mm x 15mm | | **Mounting Hole Spacing** | 30mm | | **Compliance** | RoHS & REACH compliant | --- ## 2. Key Features and Components ### A. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, the "pushPIN" system uses a brass or plastic pin with a high-tension spring. - **Benefit:** Ensures constant pressure on the electronic component, which improves thermal transfer. - **Reliability:** It is vibration-resistant and easy to install or remove for maintenance. ### B. Material & Finish - **Aluminum Alloy:** Offers a balance of lightweight construction and high thermal conductivity. - **Blue Anodization:** This is not just for aesthetics; the anodized coating increases the surface area's emissivity and provides corrosion resistance and electrical insulation. ### C. Fin Geometry - **High Performance:** The square fin design is optimized for environments with low-to-medium airflow (LFM). - **Thermal Performance Table (Airflow vs. Resistance):** | Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :---: | :---: | :---: | :---: | | **Resistance (°C/W)** | 12.30 | 5.91 | 4.30 | 3.59 | --- ## 3. Application Use Cases This specific part is generally used for small-form-factor electronics where space is limited but heat dissipation is critical: 1. **Telecommunications:** Cooling of networking chips and signal processors. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Heat management for voltage regulators and power transistors. ---