The **ATS-07A-17-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Fin Type** | Straight | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) | | **Number of Fins** | Variable (Density optimized for airflow) | --- ### 2. Part Number Breakdown Understanding the nomenclature helps in identifying the exact variant: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series identifier (referring to the footprint and attachment style). * **A**: Material/Class designation. * **17**: Height of the heat sink (12.7mm corresponds to this specific code in the series). * **C2**: Thermal Interface Material (TIM). "C2" typically indicates **T766 phase change material** is pre-applied. * **R0**: RoHS Compliance status (Revision 0). --- ### 3. Electronic Application & Usage This part is categorized as a **Board Level Thermal Management** component. Its primary functions in an electronic system include: 1. **Heat Dissipation**: It increases the surface area of a hot component, allowing heat to be transferred into the ambient air more efficiently. 2. **Mechanical Stability**: The push-pin mechanism provides a consistent "clamping force" of approximately 10-20 PSI, ensuring the thermal interface material (TIM) makes perfect contact with the chip. 3. **Low Profile Cooling**: At only 12.7mm high, it is designed for space-constrained environments like 1U servers or thin networking switches. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-07A-17-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural/Low)** | 15.44 | | **200 (Active)** | 6.47 | | **400 (High)** | 3.81 | ---