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  • ATS-07A-18-C2-R0

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    The **ATS-07A-18-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for thermal management in electronic systems. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific model: | Property | Value | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 13.38 °C/W @ 100 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: - **ATS**: Advanced Thermal Solutions (Manufacturer). - **07**: Series identifier. - **A**: Specific design or fin configuration. - **18**: Specific model iteration within the series. - **C2**: Material and finish (Aluminum with Blue Anodized finish). - **R0**: Revision or packaging code. --- ### 3. Key Electronic/Mechanical Features #### Thermal Management The primary purpose of this part is to dissipate heat from electronic components like CPUs, GPUs, FPGAs, or power transistors. By increasing the surface area, it allows air to carry away heat more efficiently, preventing thermal throttling or component failure. #### The pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system uses: - **Flexible Springs**: Provide precise pressure (Force) on the component to ensure maximum thermal contact. - **Vibration Resistance**: Ideal for industrial or automotive electronics where movement is expected. - **Tool-less Installation**: Designed for rapid assembly on a PCB with pre-drilled holes. #### Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material that fills the microscopic air gaps between the heat sink and the electronic chip, significantly lowering the thermal resistance. --- ### 4. Implementation Example If you were using this in a PCB design software (like Altium or KiCad), your footprint would need to account for the two mounting holes required for the pushpins: ```text // Approximate PCB Layout Requirements Hole Diameter: 3.175mm (typical for pushPIN) Hole Spacing: 30.00mm (check datasheet for specific pitch) ```
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 13.38 °C/W thermal resistance?
    • ⤷ Does this model support custom spring tensions for delicate components?
    • ⤷ What is the weight of the ATS-07A-18-C2-R0 for vibration analysis?