The **ATS-07A-19-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Thermal Resistance** | 9.77°C/W (at 200 LFM) | | **Fin Pattern** | Straight Fin (Extruded) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal characteristics: * **ATS-07**: Series designation (typically refers to the attachment style and base footprint). * **A**: Specific revision or sub-series identifier. * **19**: Specific dimensions/geometry code within the series. * **C2**: Material and Finish code (C2 usually denotes **Blue Anodized Aluminum**). * **R0**: Versioning/Packaging indicator. --- ### 3. Key Electronic Components & Features #### A. The Heat Sink Body The core is made of **Aluminum 6063**, which is chosen for its high thermal conductivity and lightweight properties. The straight-fin design is optimized for **forced air cooling** (where a fan is present in the system). #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin and spring** assembly: * **Push-Pin:** Usually made of nylon or plastic, designed to snap into pre-drilled holes on a PCB. * **Spring:** Provides consistent "clamping force," ensuring the heat sink stays in tight contact with the chip to maximize heat transfer. #### C. Thermal Interface Material (TIM) The "C2-R0" variants often come with a pre-applied **Phase Change Material (PCM)** or thermal tape on the base. This fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. --- ### 4. Application Use Cases * **BGA Cooling:** Ideal for cooling Ball Grid Array (BGA) packages. * **Network Equipment:** Used in routers and switches where airflow is directed through the chassis. * **Embedded Systems:** Industrial PCs or automation controllers that require robust mechanical mounting.