The **ATS-07A-210-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height (Fin)** | 12.70 mm | | **Pitch** | Fine Pitch (Dense fins) | | **Thermal Resistance** | 5.18°C/W (at 100 LFM) | --- ## 2. Component Design Features The ATS-07A-210-C2-R0 is engineered for specific electronic cooling requirements: ### A. Fin Pattern (High Performance) The "210" in the part number indicates a specific cross-cut fin geometry. This design maximizes surface area and promotes turbulent airflow, which significantly reduces the thermal resistance between the electronic component and the ambient air. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses a standardized **pushPIN™** system: * **Spring-loaded mechanism:** Ensures consistent pressure across the thermal interface. * **Secure fit:** Prevents the heat sink from shifting during vibration or shipping. * **Easy Installation:** Requires pre-drilled holes on the PCB (typically 3.175mm). ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad, ensuring optimal heat transfer from the chip to the aluminum base. --- ## 3. Application Use Cases This heat sink is commonly used in high-density electronic environments such as: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Power supplies and MOSFET cooling where vertical space is limited (12.7mm height). ---