The **ATS-07A-22-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components using Advanced Thermal Solutions' (ATS) proprietary "push-pin" attachment mechanism. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 54.00mm x 54.00mm | | **Height (Off Base)** | 12.70mm | | **Thermal Resistance** | 13.87°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Management Efficiency The "C2" in the part number indicates the material and finish (Blue Anodized Aluminum). This finish increases the surface emissivity, which improves heat radiation away from the sensitive electronic component (like a CPU, FPGA, or GPU). #### 2. Push-Pin Mounting System Instead of using messy adhesives or permanent solder, this part uses a **spring-loaded push-pin** system. * **Engagement:** The pins click into pre-drilled holes on the PCB. * **Compression:** The springs ensure consistent pressure across the Thermal Interface Material (TIM), which is critical for maximizing heat transfer efficiency. #### 3. Airflow Optimization The straight-fin design is optimized for environments with forced air (fans). * **Low Profile:** At only 12.7mm tall, it is ideal for high-density electronic enclosures or 1U server racks where vertical space is limited. #### 4. Pre-applied TIM (T766) The part comes with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste during assembly, reducing the risk of air bubbles or uneven cooling. --- ### Common Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial PCs where vibration resistance is needed (push-pins are more secure than tape). * **Power Supplies:** Dissipating heat from power transistors.