The **ATS-07A-24-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the "push pin" attachment series designed for efficient cooling of integrated circuits (ICs). ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W)** | 60.00 mm x 60.00 mm | | **Height** | 20.00 mm | | **Thermal Resistance** | 1.83°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Spring | --- ### 2. Key Component Features * **Heat Sink Material:** Constructed from high-quality aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. * **Thermal Performance:** It is designed for "cross-cut" airflow. The thermal resistance of **1.83°C/W** indicates that for every watt of power the chip dissipates, the temperature will rise by 1.83 degrees Celsius above the ambient air (assuming 200 Linear Feet per Minute of airflow). * **Attachment Mechanism:** * **Push-Pins:** Uses pre-assembled plastic push-pins that click into pre-drilled holes in the PCB. * **Springs:** Features a compression spring system that provides a consistent, high-pressure interface between the heat sink and the processor/component to maximize heat transfer. * **Interface Material:** Usually comes with a **Thermal Interface Material (TIM)** pre-applied to the base (often a Phase Change Material or Thermal Tape) to fill microscopic air gaps between the chip and the metal. --- ### 3. Application Use Cases This specific heat sink size (60x60mm) is typically used for cooling: 1. **High-Power Processors:** FPGAs, ASICs, and high-end CPUs. 2. **Network Hardware:** Cooling chipsets in routers and switches. 3. **Industrial Controllers:** Protecting power-dense electronics from overheating in enclosed environments. ---