The **ATS-07A-29-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 7.57°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45.00mm x 45.00mm x 20.00mm | --- ### 2. Electronic & Mechanical Design Parts The assembly of the ATS-07A-29-C2-R0 consists of several critical sub-components that work together to protect sensitive electronics: #### A. The Heat Sink Body (Fin Array) * **Fin Type:** It features a **Straight Fin** design. This is optimized for airflow passing across the length of the fins. * **Material:** Made of high-grade aluminum for a balance of lightweight construction and high thermal conductivity. * **Surface:** The "Blue Anodized" coating prevents corrosion and slightly increases surface emissivity for radiation cooling. #### B. The Push-Pin Fasteners * **Function:** This model uses a spring-loaded push-pin mechanism. It eliminates the need for screws and ensures a consistent downward pressure (clamping force) onto the electronic chip. * **Component:** Includes a durable plastic or brass pin and a compression spring. #### C. Thermal Interface Material (TIM) * **Standard Configuration:** These units typically come with **T766** pre-applied thermal phase-change material or grease on the base. * **Purpose:** To fill microscopic air gaps between the component (chip) and the heat sink base to maximize heat transfer. --- ### 3. Application Use Cases This specific part is generally found in: * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Managing heat in high-efficiency DC-DC converters. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 7.57 | 2.55 | 1.51 | 1.13 |