The **ATS-07A-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07A-30-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (LFM)** | 5.31 °C/W (@100 LFM) to 1.05 °C/W (@700 LFM) | | **Dimensions (L x W x H)** | 70mm x 46.9mm x 25mm | --- ### 2. Key Electronic Components & Design Features #### A. The Fin Design (Cross-Cut) The unit features a **straight fin** or **cross-cut** pattern. In electronics, the fin geometry is critical because it determines the surface area available for heat dissipation. The "C2" in the part number indicates a specific density of fins optimized for forced air (fan) environments. #### B. The pushPIN™ Attachment System Rather than using messy adhesives or permanent thermal epoxy, this part utilizes a specialized mechanical attachment: * **Springs:** Provide consistent pressure (Force) on the electronic chip, ensuring optimal contact. * **Brass Bolts/Plastic Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "R0" designation typically implies the inclusion of a high-performance **Thermal Interface Material**. This is the layer that sits between the electronic component (die) and the aluminum base to fill microscopic air gaps, significantly reducing thermal resistance. --- ### 3. Usage in Electronic Systems This specific heat sink is used in hardware where heat must be moved away from a surface to prevent "Thermal Throttling" or hardware failure. Common applications include: 1. **Industrial Controllers:** Cooling power MOSFETs or IGBTs. 2. **Networking Gear:** Cooling high-speed ASICs in routers or switches. 3. **Embedded Systems:** For single-board computers that operate in high-temperature environments. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 5.31 | 1.88 | 1.30 | 1.05 | | **Ducted Flow (°C/W)** | 1.72 | 1.12 | 0.94 | 0.84 |