ATS-07A-34-C2-R0
AI

The **ATS-07A-34-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. While it is not an active electronic component (like an IC), it is a critical passive mechanical component used to manage the thermal profile of electronics.
---
### 1. Technical Specifications
The part belongs to the **pushPIN™** thermal management series. Below are the key physical and thermal characteristics:
| Property | Description |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Straight |
| **Dimension (Length x Width)** | 35mm x 35mm |
| **Height** | 15mm |
| **Thermal Resistance** | 14.33 °C/W (Unducted Flow @ 100 LFM) |
---
### 2. Design and Construction
The "34" series design focuses on maximizing surface area within a specific footprint.
* **Heat Sink Material:** Extruded aluminum, which provides a balance between cost, weight, and thermal conductivity.
* **Fin Configuration:** Features a high-density straight fin design suitable for systems with existing airflow (forced convection).
* **Thermal Interface Material (TIM):** This specific part number (R0) typically comes pre-applied with **T766** phase-change material or similar, ensuring efficient heat transfer from the component to the sink.
---
### 3. Mounting Mechanism (pushPIN™)
One of the defining features of this part is the mounting system:
* **Spring-loaded Bolts:** It uses a push-pin with a flexible spring to ensure constant, even pressure across the electronic component (CPU, GPU, or MOSFET).
* **Reliability:** The spring mechanism prevents the heat sink from shifting during vibration or mechanical shock, which is common in industrial or automotive applications.
---
### 4. Application Use Cases
This heat sink is designed for components that generate moderate heat in space-constrained environments:
1. **Networking Hardware:** Switches and routers where airflow is provided by chassis fans.
2. **Embedded Systems:** Industrial PCs or single-board computers (SBCs).
3. **Power Electronics:** Cooling voltage regulators or high-speed BGA packages.
---
- ⤷
What is the difference between the C1 and C2 versions of this heat sink?
- ⤷ How do I calculate if 14.33 °C/W is sufficient for my specific chip?
- ⤷ Can this heat sink be mounted using adhesive instead of push-pins?