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  • ATS-07A-34-C2-R0

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    The **ATS-07A-34-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. While it is not an active electronic component (like an IC), it is a critical passive mechanical component used to manage the thermal profile of electronics. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** thermal management series. Below are the key physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight | | **Dimension (Length x Width)** | 35mm x 35mm | | **Height** | 15mm | | **Thermal Resistance** | 14.33 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Construction The "34" series design focuses on maximizing surface area within a specific footprint. * **Heat Sink Material:** Extruded aluminum, which provides a balance between cost, weight, and thermal conductivity. * **Fin Configuration:** Features a high-density straight fin design suitable for systems with existing airflow (forced convection). * **Thermal Interface Material (TIM):** This specific part number (R0) typically comes pre-applied with **T766** phase-change material or similar, ensuring efficient heat transfer from the component to the sink. --- ### 3. Mounting Mechanism (pushPIN™) One of the defining features of this part is the mounting system: * **Spring-loaded Bolts:** It uses a push-pin with a flexible spring to ensure constant, even pressure across the electronic component (CPU, GPU, or MOSFET). * **Reliability:** The spring mechanism prevents the heat sink from shifting during vibration or mechanical shock, which is common in industrial or automotive applications. --- ### 4. Application Use Cases This heat sink is designed for components that generate moderate heat in space-constrained environments: 1. **Networking Hardware:** Switches and routers where airflow is provided by chassis fans. 2. **Embedded Systems:** Industrial PCs or single-board computers (SBCs). 3. **Power Electronics:** Cooling voltage regulators or high-speed BGA packages. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the C1 and C2 versions of this heat sink?
    • ⤷ How do I calculate if 14.33 °C/W is sufficient for my specific chip?
    • ⤷ Can this heat sink be mounted using adhesive instead of push-pins?