The **ATS-07A-35-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an active electronic component (like a chip), it is a critical passive mechanical component used for the thermal management of electronics. Below is the detailed breakdown of its specifications and electronic application. --- ## 1. Technical Specifications The part belongs to the **pushPIN™** Heat Sink Assembly series, designed for quick and secure mounting. | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic pins and springs) | | **Thermal Resistance** | 22.48°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | Straight Fin | | **TIM (Thermal Interface Material)** | T766 (High-performance grease/pad) | --- ## 2. Component Features ### A. The PushPIN™ Mounting System The "-R0" suffix refers to the specific mounting hardware. This system uses a spring-loaded pin that passes through pre-drilled holes in the Printed Circuit Board (PCB). * **Benefits:** Ensures even pressure across the component (like a BGA or CPU), improving heat transfer compared to simple adhesive tapes. * **Reliability:** Resistant to vibration and shock, making it suitable for industrial electronics. ### B. Thermal Performance Thermal resistance (measured in °C/W) determines how much the component temperature rises per watt of power dissipated. * **Low Airflow:** At 100 LFM (Linear Feet per Minute), the resistance is **22.48°C/W**. * **High Airflow:** At 600 LFM, the resistance drops significantly to **4.34°C/W**, indicating it is highly efficient in forced-convection (fan-cooled) environments. ### C. Material & Finish * **Aluminum 6063:** Chosen for its balance of thermal conductivity and weight. * **Blue Anodized:** The coating protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ## 3. Electronic Applications This heat sink is typically used for cooling the following types of electronic parts: 1. **BGA (Ball Grid Array) Chips:** Processors, FPGAs, or GPUs with a 35x35mm footprint. 2. **Power Converters:** Voltage regulators that generate significant heat in a small area. 3. **Embedded Systems:** Industrial PCs where space is limited (10mm height profile). --- ## 4. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **07** | Series Identifier | | **A** | Material (Aluminum) | | **35-35** | Footprint dimensions (35mm x 35mm) | | **10** (implied) | Height (10mm) | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Packaging code | ---