The **ATS-07A-38-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~6.42 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ## 2. Key Electronic Features ### A. Material Conductivity The heat sink is made from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just aesthetic; it increases emissivity and provides a layer of electrical insulation and corrosion resistance. ### B. Thermal Performance This component is categorized under the **maxiFLOW™** or standard high-density fin patterns. * **Low Airflow:** At low speeds (200 LFM), the thermal resistance is approximately **4.01 °C/W**. * **High Airflow:** Under forced convection (approx. 800 LFM), it drops to roughly **1.83 °C/W**, making it highly efficient for server environments. ### C. Attachment Mechanism (Push-Pin) The "07A" and "R0" designations often refer to the specific mounting hardware. * **Mechanical Stability:** Uses a spring-loaded push-pin mechanism. * **Pressure:** The springs provide consistent pressure on the TIM (Thermal Interface Material), ensuring there are no air gaps between the chip and the heat sink. * **Pre-Applied TIM:** These units typically come with **Phase Change Material (PCM)** or high-performance thermal tape pre-applied to the base to simplify assembly. --- ## 3. Application Use Cases 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial PCs:** Used in fanless or forced-air ruggedized systems. 3. **Embedded Systems:** Ideal for BGA (Ball Grid Array) packages that generate significant heat in a compact footprint. ---