The **ATS-07A-39-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 12.7mm | | **Thermal Resistance** | 18.94 °C/W (at 100 LFM) | | **Airflow Direction** | Vertical/Horizontal (Omnidirectional) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry The "C2" in the part number refers to the specific fin design. Unlike standard extruded heat sinks, these feature a flared fin pattern. This increases the surface area and maximizes air turbulence, significantly improving cooling efficiency in restricted airflow environments. #### B. pushPIN™ Attachment The "R0" indicates the attachment mechanism. This part uses a **pushPIN™** system which includes: * A brass or plastic pin. * A stainless steel spring for consistent pressure. * Pre-drilled holes in the PCB are required for installation. #### C. Thermal Interface Material (TIM) The heat sink comes pre-applied with **T766** thermal grease. This ensures low contact resistance between the electronic component (heat source) and the aluminum base of the heat sink right out of the box. --- ### 3. Decoding the Part Number The part number can be broken down to understand its configuration: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **07**: Series identifier. * **A**: Attachment type (Spring/Pin). * **39**: Physical dimensions/form factor code. * **C2**: Performance class and fin density. * **R0**: Versioning and packaging code. --- ### 4. Applications This electronic part is typically found in: 1. **Telecommunications**: Cooling chipsets in routers and switches. 2. **Embedded Systems**: Industrial PCs and IoT gateways. 3. **Power Electronics**: Voltage regulators and high-speed processors.