The **ATS-07A-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Pitch** | Super Fine (High density fins) | | **Thermal Resistance** | 13.16°C/W (at 1.0 m/s airflow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of Part Numbering Understanding the nomenclature reveals the part's characteristics: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Heat sink series/family. * **A:** Attachment style (standard hole pattern). * **57:** Specific design configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code. --- ### 3. Key Electronic Cooling Features #### High-Efficiency Fin Design The "Super Fine" pitch refers to the high density of aluminum fins. This increases the total surface area available for heat dissipation, making it ideal for high-power electronics where space is limited. #### PushPIN™ Attachment System Instead of using messy thermal adhesives or complex brackets, this part uses a **pushPIN™** system. It features: * A pre-assembled brass component with a stainless steel spring. * A "click" engagement that ensures the heat sink is held against the electronic component with the correct amount of pressure (load). #### Thermal Interface Material (TIM) The part comes with **T766** material pre-applied to the base. This material fills the microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance and ensuring the CPU/GPU stays within safe operating temperatures. --- ### 4. Implementation Code Example In thermal simulation or PCB design software (like Altium or Eagle), you might define the thermal properties of this component as follows: ```json { "component_id": "ATS-07A-57-C2-R0", "type": "Heat Sink", "dimensions": { "x": 40.0, "y": 40.0, "z": 15.0, "unit": "mm" }, "thermal_resistance_forced_convection": { "airflow_100_lfm": 13.16, "airflow_500_lfm": 3.12 }, "mounting": "pushPIN-2-hole" } ``` ---