The **ATS-07A-65-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to maximize surface area and improve airflow across electronic components. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-07A-65-C2-R0 | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | | **RoHS Status** | Compliant | --- ### 2. Design and Component Features #### A. The maxiFLOW™ Fin Geometry The "C2" in the part number refers to the specific fin design. These heat sinks feature a **tapered fin structure** which reduces pressure drop and allows for high-velocity air to penetrate deeper into the fin array. This makes it ideal for high-density PCBs where airflow might be obstructed. #### B. pushPIN™ Attachment System Unlike traditional adhesive tapes, this part uses the **pushPIN™** system: * **Hardware:** Includes a flexible spring and a plastic/brass pin. * **Security:** Provides a precise, high-pressure fit against the component (CPU/GPU/FPGA), ensuring optimal thermal interface material (TIM) performance. * **Reliability:** Resistant to vibration and shock compared to "peel-and-stick" methods. #### C. Material and Coating * **Base Material:** Extruded Aluminum, which provides a balance between lightweight design and thermal conductivity. * **Finish:** Black Anodized. This is not just for aesthetics; the black anodized finish increases **emissivity**, allowing the part to radiate heat more effectively into the surrounding air. --- ### 3. Thermal Performance Profile The performance of the ATS-07A-65-C2-R0 is highly dependent on the velocity of the air (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.29 | | 200 | 2.36 | | 300 | 1.49 | | 400 | 1.15 | --- ### 4. Typical Applications This component is generally used to cool high-heat-generating semiconductors in the following fields: * **Networking:** Switches, routers, and base stations. * **Industrial Power:** Power supplies and motor controllers. * **Computing:** High-speed processors or FPGAs on embedded boards.