The **ATS-07A-66-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 5.77 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Flow Orientation** | Vertical Fin (Cross-cut) | --- ### 2. Breakdown of the Model Number The part number can be decoded as follows: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Specific series/designator. * **A**: Attachment type (typically refers to specific push-pin hardware). * **66**: Height/Profile code (35mm height). * **C2**: Thermal interface material (usually signifies **T766** high-performance phase change material). * **R0**: RoHS compliance/revision status. --- ### 3. Key Electronic Cooling Components The ATS-07A-66-C2-R0 is not an "electronic" part in terms of circuitry, but it is a critical **mechanical thermal management component**. Its effectiveness relies on three elements: #### A. The Heat Sink Body The body is made of extruded aluminum. The "Cross-cut" fin design allows air to flow from multiple directions, making it more efficient in environments where airflow might be turbulent or unpredictable. #### B. Push-Pin Fasteners Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. * **Pressure:** The springs provide consistent pressure on the chip. * **Reliability:** It ensures the heat sink remains in contact with the component even during vibration or thermal expansion. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that a **pre-applied thermal pad** is included on the bottom surface. This material fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. --- ### 4. Application Use Cases * **FPGA Cooling:** Ideal for Field Programmable Gate Arrays that generate significant heat. * **Embedded Systems:** Used in industrial PCs where long-term reliability is required. * **Networking Gear:** Cooling for high-speed switch or router processors.