The **ATS-07A-70-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically engineered for high-velocity airflow environments commonly found in telecommunications and networking equipment. --- ### 1. Technical Specifications Below are the primary physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 0.87°C/W @ 200 LFM | | **Fin Style** | Spread Fin (maxiFLOW™) | | **Pressure Drop** | 0.12 in H2O @ 200 LFM | --- ### 2. Design Characteristics The "electronic parts" of this assembly include the heat sink body and the specific mechanical interface components: #### A. maxiFLOW™ Fin Geometry The fins are designed with a graduated, tapered shape. This "spread fin" geometry increases the surface area significantly compared to standard straight-fin heat sinks, which maximizes heat dissipation while maintaining a low pressure drop. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Springs:** High-performance compression springs ensure consistent pressure on the processor or PCB component. * **Pins:** Usually nylon or brass pins that lock into the PCB holes (requires pre-drilled holes in the motherboard). * **Stability:** This mechanical attachment is more reliable than thermal tape for heavy heat sinks or high-vibration environments. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. This model typically comes with **pre-applied T766 Phase Change Material** or high-performance thermal grease. This eliminates the need for manual application and ensures minimal thermal resistance between the component and the sink. --- ### 3. Applications The ATS-07A-70-C2-R0 is typically used to cool high-heat electronic components such as: * **ASICs and FPGAs:** In high-speed networking switches. * **Processors:** Embedded CPUs in industrial computers. * **Power Modules:** High-density DC-DC converters. --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions) * **07A:** Specific Series/Geometry * **70:** Dimensional code * **C2:** Thermal Interface Material / Coating type * **R0:** Revision/Packaging code