The **ATS-07A-75-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part belongs to the **maxiFLOW™** series, which uses a flared fin design to maximize surface area and airflow performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07A-75-C1-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.48°C/W (at 200 LFM) | | **Dimensions (LxWxH)** | 45mm x 45mm x 10mm | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Features While the device is mechanical, it is engineered for critical interaction with electronic systems: * **Flared Fin Geometry:** The fins are angled outward to reduce pressure drop and improve air ingestion, making it ideal for systems with constrained airflow. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism. This ensures a consistent and specific **clamping force** (pressure) on the electronic chip, which is vital for maintaining high-quality thermal contact without cracking the silicon die. * **T766 Thermal Interface Material:** The base comes pre-applied with a Phase Change Material (PCM). This fills the microscopic air gaps between the heat sink base and the electronic component to lower contact resistance. * **Blue Anodized Coating:** The aluminum is treated with a blue anodized finish, which not only prevents corrosion but also slightly increases surface emissivity for better radiant heat transfer. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). ---