Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-07A-79-C2-R0

  • AI
    The **ATS-07A-79-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### 1. Technical Specifications The part number is encoded with specific technical details regarding its dimensions, material, and thermal performance. | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Material** | Aluminum | | **Fin Style** | Straight Fin | | **Attachment Method** | Plastic Push Pin (with Brass Spring) | | **Thermal Resistance** | 2.63°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | | **Color/Finish** | Blue Anodized | --- ### 2. Physical Design Elements #### A. The Fin Geometry The "Straight Fin" design is optimized for **forced air cooling** (environments with fans). The vertical fins provide a large surface area for heat dissipation while maintaining a low pressure drop, allowing air to flow through the sink efficiently. #### B. Attachment Mechanism The **Push Pin** system consists of: * **Plastic Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Springs:** These provide a precise "clamping force" (pressure) to ensure the base of the heat sink makes firm, consistent contact with the electronic component. #### C. Thermal Interface Material (TIM) The base of this heat sink comes pre-applied with **T766 phase-change material**. This fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance compared to air. --- ### 3. Application and Usage This heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Industrial Computing:** Embedded systems where high heat density is present. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Part Number Breakdown (Standard ATS Format) | Prefix | Series/Size | Height | Mounting | Finish | | :--- | :--- | :--- | :--- | :--- | | **ATS** | **07A** | **30mm** | **Push Pin** | **Blue Anodized** | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between a push-pin and a clip-on heat sink attachment?
    • ⤷ How do I calculate if this heat sink is sufficient for my chip's TDP?
    • ⤷ Does this heat sink require a specific PCB hole diameter?