The **ATS-07A-80-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for efficient cooling of electronic components like CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table highlights the core technical properties of this part: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Fin Type** | Straight Fin | | **Fin Pattern** | COARSE-PITCH | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Data Performance is measured by thermal resistance (°C/W) relative to the velocity of airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 19.03 °C/W | 7.54 °C/W | 5.38 °C/W | 4.46 °C/W | | **Thermal Resistance (Ducted)** | 6.58 °C/W | 4.43 °C/W | 3.79 °C/W | 3.41 °C/W | --- ### 3. Key Electronic/Mechanical Features * **Attachment System:** The part uses a push-pin and spring mechanism. This provides a precise "Pre-Assembled" load to ensure consistent contact pressure with the chip, improving heat transfer. * **Thermal Interface Material (TIM):** It comes with **T766** pre-applied to the base. This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a uniform layer. * **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. * **Lightweight Design:** Weighing approximately 38 grams, it minimizes mechanical stress on the PCB (Printed Circuit Board). --- ### 4. Application Use Cases This heat sink is typically used in: 1. **Network Switches/Routers:** For cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 15mm. 3. **Power Electronics:** Cooling VRMs (Voltage Regulator Modules) or MOSFETs. ---