The **ATS-07A-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Pitch** | XC (Extra Coarse) | | **Thermal Resistance** | 8.57 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design The "XC" designation indicates an **Extra Coarse** fin pitch. This design is optimized for environments with lower airflow or where pressure drop must be minimized. The fins are typically arranged in a "Straight Fin" or "Cross-Cut" pattern to maximize surface area for heat dissipation. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the pushPIN™ system uses: - **Plastic push pins:** To secure the sink to the PCB. - **Compression springs:** To ensure uniform pressure across the component surface, which optimizes thermal transfer. - **Pre-drilled holes:** Requires specific hole spacing on the PCB for installation. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This eliminates the need for manual application of thermal grease and ensures a reliable thermal bond between the chip and the heat sink. --- ### 3. Thermal Performance (Deg C/W) Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 8.57 | 4.54 | 3.62 | 3.19 | 2.91 | --- ### 4. Applications * **Embedded Systems:** Cooling for CPUs, GPUs, or FPGAs. * **Telecommunications:** Networking equipment where vertical space is limited to 20mm. * **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators.