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  • ATS-07A-92-C2-R0

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    The **ATS-07A-92-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, and high-heat ICs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | High-Performance (Cross-Cut) | | **Thermal Resistance** | ~16.48°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design Breakdown #### A. The Heat Sink Body The device uses a **Cross-Cut** fin design. Unlike straight-line fins, cross-cut fins allow air to flow in multiple directions, which is ideal for systems where the airflow direction is inconsistent or turbulent. #### B. The pushPIN™ Attachment The "07A" and "R0" designations often refer to the specific mounting hardware. This system includes: * **Brass Push Pins:** Provides secure attachment to the PCB. * **Compression Springs:** Ensures consistent pressure between the heat sink and the electronic chip to maximize heat transfer. #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a phase-change material or grease that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ### 3. Application in Electronics This part is typically used in the following scenarios: 1. **Networking Hardware:** Cooling ASICs in switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 16.48 | | 200 | 6.17 | | 400 | 3.46 | | 600 | 2.59 |
    ✨ Follow-up Questions
    • ⤷ How does the 'C2' thermal interface material compare to manual thermal paste application?
    • ⤷ What are the specific PCB hole requirements for the pushPIN mounting system?
    • ⤷ Are there copper versions of this heat sink for higher heat dissipation?