ATS-07A-92-C2-R0
AI

The **ATS-07A-92-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, and high-heat ICs.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 15mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | High-Performance (Cross-Cut) |
| **Thermal Resistance** | ~16.48°C/W (Unducted Flow @ 100 LFM) |
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### 2. Design Breakdown
#### A. The Heat Sink Body
The device uses a **Cross-Cut** fin design. Unlike straight-line fins, cross-cut fins allow air to flow in multiple directions, which is ideal for systems where the airflow direction is inconsistent or turbulent.
#### B. The pushPIN™ Attachment
The "07A" and "R0" designations often refer to the specific mounting hardware. This system includes:
* **Brass Push Pins:** Provides secure attachment to the PCB.
* **Compression Springs:** Ensures consistent pressure between the heat sink and the electronic chip to maximize heat transfer.
#### C. Thermal Interface Material (TIM)
The "C2" suffix typically denotes that the heat sink comes with a **pre-applied Thermal Interface Material**. This is a phase-change material or grease that fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance.
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### 3. Application in Electronics
This part is typically used in the following scenarios:
1. **Networking Hardware:** Cooling ASICs in switches and routers.
2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.
3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.
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### 4. Thermal Performance Comparison
*Performance varies based on Airflow (LFM - Linear Feet per Minute):*
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 16.48 |
| 200 | 6.17 |
| 400 | 3.46 |
| 600 | 2.59 |
- ⤷
How does the 'C2' thermal interface material compare to manual thermal paste application?
- ⤷ What are the specific PCB hole requirements for the pushPIN mounting system?
- ⤷ Are there copper versions of this heat sink for higher heat dissipation?