The **ATS-07A-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *maxiFLOW™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. Component Overview This part is designed to dissipate heat from electronic components such as CPUs, GPUs, FPGAs, and power modules that utilize BGA (Ball Grid Array) packaging. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Material** | Aluminum (Body), Copper (optional variants) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) to 2.32 °C/W (at 700 LFM) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring there is no interference with nearby capacitors or connectors. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 25.00 mm * **Pin Pitch (Spacing):** 43.00 mm --- ### 3. Thermal Performance (Cooling Efficiency) Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower numbers are better. | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.29 | | 300 | 1.5 | 3.22 | | 500 | 2.5 | 2.58 | | 700 | 3.5 | 2.32 | --- ### 4. Key Electronic Design Features * **maxiFLOW™ Geometry:** The fin structure features a flared design which increases the surface area for convection while maintaining a low pressure drop. This is ideal for systems with high-density components. * **pushPIN™ Attachment:** Unlike adhesive tapes, the pushPIN™ system uses a brass component and a stainless steel spring. This provides a precise, calculated pressure (Pre-assembled) against the electronic chip to ensure optimal contact with the Thermal Interface Material (TIM). * **Pre-applied TIM:** These units typically come with **Phase Change Material (PCM)** or high-performance thermal grease pre-applied to the base, reducing assembly time and ensuring uniform heat transfer. * **Non-Conductive Finish:** The blue anodized coating provides a layer of electrical insulation and corrosion resistance, preventing accidental shorts if the sink were to touch exposed traces (though physical clearance is always recommended). --- ### 5. Application Use Cases 1. **Telecommunications:** Used in routers and switches where high-velocity airflow is present. 2. **Embedded Systems:** Cooling industrial PCs and controllers. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or high-speed processors.