The **ATS-07A-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications | Parameter | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Product Category** | Heat Sinks | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 5.63°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height (Fin Height):** 25.00 mm * **Pitch (Hole-to-Hole):** 45.00 mm --- ### 3. Key Electronic/Mechanical Features ### A. Fin Design (Cross-Cut) The unit features a **straight fin** or **cross-cut** pattern (depending on specific sub-variants in the 96-C2 range). This design optimizes airflow from multiple directions, making it suitable for systems with varying fan orientations. ### B. Push-Pin Attachment Instead of using adhesive tape or screws, this part uses a **Push-Pin** system with a compression spring. * **Reliability:** Provides consistent pressure on the electronic component (TIM - Thermal Interface Material). * **Assembly:** Allows for quick "snap-on" installation onto the PCB via pre-drilled holes. ### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied high-performance **Thermal Interface Material** (like T766) on the base. This ensures there are no air gaps between the chip and the heat sink, maximizing heat transfer. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as the airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 5.63 | | 200 | 1.0 | 1.81 | | 300 | 1.5 | 1.21 | | 400 | 2.0 | 0.92 | --- ### Usage Note This part is typically used in **telecommunications, networking equipment, and industrial computers** where high-power components generate significant heat in a confined space.