ATS-07B-101-C3-R0
AI

The **ATS-07B-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "push-pin" series designed for cooling small electronic components like CPUs, GPUs, or high-power transistors.
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## Technical Specifications
The following table details the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Dimensions (L x W x H)** | 45mm x 45mm x 30mm |
| **Fin Style** | Straight (Cross-cut) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 6.70°C/W (at 100 LFM) |
| **Interface Material** | T412 (Thermal Grease / Tape) |
| **Finish** | Blue Anodized |
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## Key Components and Features
### 1. Thermal Performance (C3)
The "C3" in the part number indicates the thermal performance category under specific airflow conditions. This heat sink is designed for **high-efficiency heat dissipation** in forced-air environments.
### 2. Push-Pin Attachment
Instead of using screws or adhesives, this part utilizes a **plastic push-pin and spring mechanism**.
- **Pros:** Provides consistent pressure on the electronic chip, ensuring better thermal contact.
- **Ease of Use:** Allows for tool-free installation and removal on pre-drilled PCBs.
### 3. Material and Coating
- **Aluminum:** Chosen for its excellent weight-to-thermal conductivity ratio.
- **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity and protects the aluminum from corrosion.
### 4. Cross-Cut Fin Design
The fins are designed to be "straight-cut," which allows air to flow through the heat sink from multiple directions. This makes it ideal for systems where the airflow direction might be unpredictable or restricted.
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## Typical Applications
This component is typically found in:
* **Networking Hardware:** Routers, switches, and modems.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
* **Telecom:** Base station electronics.
- ⤷
What is the hole-to-hole spacing requirement for the push-pin installation?
- ⤷ How does the thermal resistance change at higher airflow (e.g.
- ⤷ 500 LFM)?
- ⤷ Is there a version of this heat sink that uses a screw-down attachment instead of push-pins?