The **ATS-07B-129-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an "electronic part" in terms of having circuits or semi-conductors, it is a critical **thermal management component** used to protect electronic parts (like CPUs or GPUs) from overheating. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its dimensions and performance. | Specification | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 60.00mm x 60.00mm | | **Height** | 10.00mm (Low Profile) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 8.68°C/W (at 100 LFM) | --- ### 2. Key Physical Components #### A. Fin Design: "XC" (Cross-Cut) This model features a **straight fin** design with a cross-cut pattern. This allows for multi-directional airflow, meaning the heat sink can dissipate heat effectively regardless of which way the internal fan is blowing. #### B. The Push-Pin Mechanism The "R0" at the end of the part number indicates the attachment hardware. * **Push-Pin:** Uses a spring-loaded plastic pin that snaps into pre-drilled holes on the PCB. * **Springs:** The springs provide precise, consistent pressure to ensure maximum contact between the heat sink and the chip. #### C. Thermal Interface Material (TIM) The "C2" indicates the pre-applied thermal material. * **ATS-PPS-02:** This is a high-performance thermal grease pre-applied to the base of the heat sink to fill microscopic air gaps between the heat sink and the electronic component. --- ### 3. Usage and Application The **ATS-07B-129-C2-R0** is primarily used in space-constrained environments due to its low 10mm height. * **Target Components:** Northbridge/Southbridge chips, FPGAs, ASICs, and low-power processors. * **Industries:** Networking (routers/switches), industrial computing, and telecommunications. --- ### 4. Thermal Performance Overview Thermal resistance measures how effectively the part moves heat away from the chip. ```text Airflow Velocity | Thermal Resistance (Unducted) ----------------------------------------------- 100 LFM (0.5 m/s)| 8.68 °C/W 300 LFM (1.5 m/s)| 3.11 °C/W 500 LFM (2.5 m/s)| 2.25 °C/W ``` *Note: As airflow (LFM) increases, the resistance drops significantly, meaning the cooler works much better with an active fan.*