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  • ATS-07B-18-C2-R0

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    The **ATS-07B-18-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-generating surface-mount devices. --- ### 1. Technical Specifications The component is defined by its material composition and physical dimensions to optimize thermal dissipation. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 13.38°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 15.00mm | --- ### 2. Design Characteristics The part number encodes specific structural information about the unit: * **Heat Sink Pattern:** The "B" in the part number indicates a **Fine-Pitch** fin design. This provides a larger surface area relative to its footprint, making it ideal for high-velocity airflow environments. * **Thermal Interface Material (TIM):** It typically comes with **T766** pre-applied, which is a high-performance thermal phase-change material that ensures minimal air gaps between the heat sink and the component. * **Attachment Mechanism:** The `pushPIN™` system utilizes a spring-loaded mechanism that provides a consistent, high-pressure connection to the PCB, ensuring reliability during mechanical shock or vibration. --- ### 3. Thermal Performance Matrix Performance varies based on the airflow (Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 13.38°C/W | | 200 (1.0 m/s) | 4.95°C/W | | 300 (1.5 m/s) | 2.69°C/W | | 400 (2.0 m/s) | 1.96°C/W | --- ### 4. Application Use Cases 1. **Networking:** Cooling ASICs in switches and routers. 2. **Industrial PCs:** Thermal management for compact embedded systems. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the different spring options available for the pushPIN attachment?
    • ⤷ How does 'Ducted' thermal resistance differ from 'Unducted' for this part?
    • ⤷ Can this heat sink be used with custom thermal interface materials?