ATS-07B-18-C2-R0
AI

The **ATS-07B-18-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat-generating surface-mount devices.
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### 1. Technical Specifications
The component is defined by its material composition and physical dimensions to optimize thermal dissipation.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 13.38°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height** | 15.00mm |
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### 2. Design Characteristics
The part number encodes specific structural information about the unit:
* **Heat Sink Pattern:** The "B" in the part number indicates a **Fine-Pitch** fin design. This provides a larger surface area relative to its footprint, making it ideal for high-velocity airflow environments.
* **Thermal Interface Material (TIM):** It typically comes with **T766** pre-applied, which is a high-performance thermal phase-change material that ensures minimal air gaps between the heat sink and the component.
* **Attachment Mechanism:** The `pushPIN™` system utilizes a spring-loaded mechanism that provides a consistent, high-pressure connection to the PCB, ensuring reliability during mechanical shock or vibration.
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### 3. Thermal Performance Matrix
Performance varies based on the airflow (Linear Feet per Minute - LFM).
| Air Velocity (LFM) | Thermal Resistance (Unducted) |
| :--- | :--- |
| 100 (0.5 m/s) | 13.38°C/W |
| 200 (1.0 m/s) | 4.95°C/W |
| 300 (1.5 m/s) | 2.69°C/W |
| 400 (2.0 m/s) | 1.96°C/W |
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### 4. Application Use Cases
1. **Networking:** Cooling ASICs in switches and routers.
2. **Industrial PCs:** Thermal management for compact embedded systems.
3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
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What are the different spring options available for the pushPIN attachment?
- ⤷ How does 'Ducted' thermal resistance differ from 'Unducted' for this part?
- ⤷ Can this heat sink be used with custom thermal interface materials?