The **ATS-07B-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, or power transistors. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Part Family** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.35°C/W (at 100 LFM) | | **Weight** | ~55 grams | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (Straight Fin) The "192" series features a **straight fin** design. In electronics, this is ideal for systems with a defined airflow direction (forced air). The fins increase the surface area, allowing heat to transfer from the semiconductor junction to the ambient air more efficiently. #### 2. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the part comes pre-applied with **T766 Phase Change Material**. - This acts as the "electronic bridge" between the component (like a chip) and the metal. - It fills microscopic air gaps to ensure maximum thermal conductivity. #### 3. Push-Pin Mounting System Instead of using adhesive tape, which can fail under high heat, this part uses a mechanical push-pin system: - **Spring Tension:** Provides precise vertical pressure to ensure the heat sink stays in contact with the electronic chip. - **Reliability:** Prevents the part from shifting during vibration or shipping of the electronic assembly. #### 4. Material Conductivity The use of **Aluminum (AL6063)** provides a balance between lightweight design and high thermal conductivity, protecting sensitive electronic circuits from "Thermal Throttling" or permanent heat damage. --- ### Usage Context This part is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards. * **Power Supplies:** Cooling MOSFETs or voltage regulators.