The **ATS-07B-210-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, specifically part of their "push pin" series. Below is a detailed breakdown of its specifications, electronic application, and technical features. --- ### 1. Technical Specifications This component is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or high-power chipsets. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 70mm x 70mm x 12.7mm | | **Thermal Resistance** | 5.18°C/W @ (Unducted Flow) | | **Fin Type** | Straight Fin | --- ### 2. Physical Design & Composition * **Material (Aluminum):** Provides a balance between thermal conductivity and weight. The **Blue Anodized** finish is not just for aesthetics; it increases the surface emissivity, slightly improving radiation cooling and protecting against corrosion. * **Low Profile:** At only 12.7mm in height, this part is ideal for "low-profile" electronics where vertical space is limited (e.g., 1U servers or compact embedded systems). * **Push-Pin Mechanism:** It utilizes a plastic push-pin with a built-in spring. This ensures constant pressure between the heat sink and the chip, which is vital for maintaining a consistent thermal interface. --- ### 3. Thermal Performance Factors The efficiency of the ATS-07B-210-C2-R0 is measured by its thermal resistance (expressed in °C/W). The lower the number, the better the heat transfer. * **Airflow Dependency:** Like most passive heat sinks, its performance improves significantly with airflow (Measured in Linear Feet per Minute - LFM). * **Thermal Interface Material (TIM):** This specific model typically comes with **pre-applied T766 phase change material** or a similar thermal pad. This fills the microscopic air gaps between the component and the heat sink. --- ### 4. Common Applications * **Networking Gear:** Switches, routers, and high-speed modems. * **Industrial PCs:** Compact motherboards where active cooling (fans) might be prone to failure. * **Power Supplies:** Cooling MOSFETs or power conversion modules. * **FPGA & ASICs:** Cooling high-gate-count chips that generate localized heat. ---