The part number **ATS-07B-29-C2-R0** refers to a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like CPUs, GPUs, and ASICs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 70mm x 70mm x 20mm | | **Thermal Resistance** | 7.57 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Flow Direction** | Spread Fin (High performance) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Electronic Application and Design While the heat sink itself is a mechanical component, its "electronic" relevance lies in its thermal management capabilities: * **Thermal Dissipation:** It is designed to move heat away from high-power electronic packages. The **maxiFLOW™** fin pattern features a tapered design that increases the surface area for convective cooling while maintaining low pressure drop. * **pushPIN™ Attachment:** The "-R0" suffix indicates a specific attachment kit. This system uses a brass component and a plastic push-pin to ensure high pressure on the electronic chip, which optimizes the contact between the die and the heat sink. * **EMI Shielding:** Because it is made of black-anodized aluminum, it provides a degree of secondary Electromagnetic Interference (EMI) shielding for the component it covers. ### 3. Component Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions). * **07:** Series/Fin geometry designation. * **B:** Material/Fin type. * **29:** Height (approximately 20mm in this configuration). * **C2:** Blue Anodized finish (Note: Standard C2 often refers to a specific color/thermal coating variant). * **R0:** Packaging and attachment hardware revision. --- ### 4. Comparison of Performance This table illustrates how the heat sink performs under different airflow conditions (Electronic System Cooling): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 7.57 | | 400 | 2.0 | 4.02 | | 600 | 3.0 | 2.85 | | 800 | 4.0 | 2.24 |