The **ATS-07B-65-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component belongs to their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power chipsets. --- ### 1. Technical Specifications The part number encodes specific data regarding its physical dimensions, material, and thermal performance. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | | **Fin Pattern** | Square Pin Fin | --- ### 2. Physical Design & Construction * **Material:** Made from aluminum to balance lightweight properties with high thermal conductivity. * **Blue Anodized Finish:** This provides a protective coating to prevent corrosion and increases surface emissivity, which slightly improves radiative heat transfer. * **Pin Fin Geometry:** Unlike straight-fin heat sinks, the square pin design allows for multidirectional airflow. This is critical in compact electronic enclosures where airflow may come from various angles. --- ### 3. Attachment Mechanism: Push-Pin The "C2" suffix in the part number indicates the attachment style. * **Compression Springs:** It uses plastic push-pins with integrated springs. * **Ease of Assembly:** These pins snap into pre-drilled holes (usually 3mm) on the PCB. * **Constant Pressure:** The spring mechanism ensures the heat sink maintains constant pressure against the electronic chip, which is vital for effective thermal transfer through the interface material. --- ### 4. Thermal Performance Data Efficiency varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 7.29 | | 200 (Low Flow) | 4.22 | | 300 (Med Flow) | 3.35 | | 500 (High Flow) | 2.50 | --- ### 5. Application Examples * **BGA Cooling:** Ball Grid Array components that generate significant heat. * **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is needed via push-pins. * **Telecommunications:** High-speed routers and switches.