The **ATS-07B-68-C2-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Pattern** | Cross-Cut (Straight) | --- ### 2. Key Electronic Functions While the heat sink itself is a passive mechanical component, its electronic function is vital for the stability of the host PCBA (Printed Circuit Board Assembly): * **Thermal Dissipation:** It increases the surface area of the component (e.g., an FPGA or ASIC), allowing heat to transfer more efficiently to the surrounding air. * **pushPIN™ Technology:** This specific model uses a spring-loaded attachment mechanism. This ensures **uniform pressure** across the electronic chip, which prevents mechanical stress on the solder balls (BGA) while maximizing contact with the thermal interface. * **Flow Optimization:** The "Cross-Cut" fin design allows air to flow through the sink from any direction, making it ideal for electronics with unpredictable internal airflow. --- ### 3. Usage Context This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in routers and switches. 2. **Embedded Systems:** Industrial motherboards where vertical space is limited (15mm height). 3. **Power Electronics:** Managing heat for high-current voltage regulators. ---