The **ATS-07B-91-C2-R0** is not a complex electronic component like an integrated circuit, but rather a **high-performance heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" Heat Sink Assembly line, designed specifically to cool electronic components like CPUs, GPUs, or power transistors. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07B-91-C2-R0 | | **Material** | Aluminum (Body), Copper (Optional Base/Pipes) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic/Brass) | | **Thermal Resistance** | Variable based on Airflow (LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Pitch** | Fine Pitch (High Density) | --- ## Key Components & Design ### 1. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific type of thermal interface material pre-applied to the base. * **T766 Phase Change Material:** This is used to fill microscopic air gaps between the heat sink and the electronic component, ensuring maximum heat transfer efficiency. ### 2. PushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system: * **Spring-loaded Pins:** Provides constant pressure to maintain a secure thermal connection. * **Reliability:** Resistant to vibration and shock, making it suitable for industrial or telecommunication equipment. ### 3. Fin Profile (Fine-Pitch) The fin geometry is optimized for **forced convection** (using a fan). The high density of the fins increases the surface area, allowing heat to dissipate rapidly into the surrounding air. ### 4. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing protects the aluminum from corrosion and slightly improves heat emissivity. --- ## Application in Electronics This part is typically used in the following scenarios: * **BGA Cooling:** Cooling Ball Grid Array chips on a PCB. * **Embedded Systems:** Industrial PCs where space is limited (10mm height). * **Power Supplies:** Managing heat in high-efficiency power modules.