The **ATS-07B-95-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is part of the "pushPIN™" thermal management line manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and physical characteristics. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07B-95-C2-R0 | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### Physical Dimensions The dimensions are critical for ensuring the part fits onto a specific Integrated Circuit (IC) or PCB layout. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 25.00 mm * **Pitch (E):** 33.00 mm (Distance between mounting holes) * **Pitch (F):** 33.00 mm --- ### Key Design Components 1. **Fin Design:** It utilizes a **Fine Pitch** pattern. This increases the surface area for heat dissipation, making it ideal for high-heat density electronic components like CPUs, GPUs, or power transistors. 2. **Attachment System (pushPIN™):** * It uses a flexible attachment system that includes a brass or plastic pin and a stainless steel spring. * This ensures a firm, consistent pressure on the component, optimizing thermal transfer. 3. **Thermal Interface Material (TIM):** * The "C2" in the part number indicates the use of **T766** thermal grease. * This is pre-applied to the base of the heat sink to eliminate air gaps between the component and the sink. 4. **Material and Coating:** * Made of lightweight Aluminum for high thermal conductivity. * The **Blue Anodized** finish provides a protective layer against corrosion and improves thermal emissivity. --- ### Common Applications This specific part is typically found in: * **Networking Equipment:** Switches and routers. * **Industrial Power Supplies:** To cool MOSFETs or voltage regulators. * **Embedded Systems:** Cooling high-performance microprocessors on specialized PCBs.