The **ATS-07B-98-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series of high-performance heat sinks. Below is a detailed breakdown of its specifications, construction, and application. --- ### 1. Technical Specifications The part is primarily defined by its thermal resistance and physical dimensions. | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07B-98-C2-R0 | | **Product Category** | Heat Sinks / Thermal Management | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Component) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W @ (Natural Convection) | | **Flow Pattern** | Straight Fin | --- ### 2. Key Design Features ### A. pushPIN™ Attachment System The "R0" at the end of the part number typically signifies the attachment style. This model uses the **pushPIN™** system, which features: * **Built-in Springs:** Provides precise pressure (Pre-assembled) to ensure maximum thermal contact. * **Brass Bolts:** Uses durable brass pins that snap into pre-drilled holes on the PCB. * **Reliability:** Designed for high-vibration environments where adhesive tapes might fail. ### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** Not just for aesthetics; the anodized layer increases surface emissivity (improving radiation heat transfer) and protects the aluminum from corrosion. ### C. Fin Configuration The **Straight Fin** design is optimized for environments where there is a consistent airflow direction. The spacing between the fins is engineered to minimize "pressure drop" while maximizing the surface area available for heat dissipation. --- ### 3. Thermal Performance Data Performance varies based on the velocity of the air (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.31 | | 200 (1.0 m/s) | 5.81 | | 300 (1.5 m/s) | 4.07 | | 400 (2.0 m/s) | 3.20 | | 500 (2.5 m/s) | 2.70 | --- ### 4. Typical Applications This heat sink is designed for mid-sized electronic components that generate significant heat in compact spaces: * **Processors (CPUs/GPUs):** For low-power or embedded industrial processors. * **ASICs & FPGAs:** Used in telecommunications and networking equipment. * **Power Supplies:** Cooling MOSFETs or power conversion modules. * **LED Drivers:** Dissipating heat from high-output LED arrays.