The **ATS-07B-99-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs. Below is the detailed breakdown of its specifications and electronic application. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Type** | Cross-Cut (Pin Fin) | | **Thermal Resistance** | 11.52°C/W (@ 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Core Electronic Components #### A. The Heatsink Body (Heat Dissipation) The part uses a **cross-cut fin design**. In electronics, this is critical because it allows for multi-directional airflow. Unlike straight-fin heatsinks, this design is more efficient in systems where the direction of the cooling fan's exhaust might be inconsistent or obstructed. #### B. The Push-Pin Mechanism Electronic PCBs (Printed Circuit Boards) require secure mechanical attachment to ensure the heatsink maintains contact with the chip. * **Compression Spring:** Provides a specific amount of "clamping force" (pressure). This ensures the heatsink does not crush the delicate silicon die but stays tight enough to transfer heat. * **Plastic/Brass Pins:** Designed to snap into pre-drilled holes (usually 3.0mm) on the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material. The **T766** material is a phase-change or high-performance grease applied to the base. * **Purpose:** It fills microscopic air gaps between the electronic component and the aluminum base, significantly reducing thermal impedance. --- ### 3. Application in Circuitry This component is typically found in the following electronic environments: 1. **High-Speed Computing:** Cooling chipsets on motherboards. 2. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Industrial PCs where passive or low-airflow cooling is required. ---