The **ATS-07D-01-C1-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink designed for cooling integrated circuits (ICs) and other surface-mount components. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. Technical Specifications | Feature | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 29.82°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 40mm x 40mm x 10mm | --- ### 2. Physical Design & Geometry The design of this heat sink is optimized for compact electronic enclosures where vertical space is limited. * **Fin Style:** It utilizes a **Square Fin (Straight Fin)** pattern. This design is effective for impingement cooling or longitudinal airflow. * **Low Profile:** With a height of only **10mm**, it is suitable for low-clearance PCB layouts. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. T412 is a high-performance thermal tape/pad that ensures efficient heat transfer from the electronic component (CPU, GPU, or MOSFET) to the aluminum base. --- ### 3. Electronic Application & Performance Thermal management is critical in electronics to prevent **thermal throttling** or component failure. The performance of the ATS-07D-01-C1-R0 varies based on the airflow (LFM - Linear Feet per Minute) provided by system fans: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 29.82 | | 300 (1.5 m/s) | 9.22 | | 500 (2.5 m/s) | 6.11 | | 700 (3.5 m/s) | 4.81 | --- ### 4. Mounting Mechanism (pushPIN™) The "C1" in the part number indicates the mounting hardware. The push-pin system provides: 1. **Consistent Pressure:** A built-in spring ensures a specific amount of force (load) is applied to the component, preventing the heat sink from shifting or losing contact. 2. **Tool-less Installation:** Plastic push-pins snap into 3.0mm holes on the PCB, allowing for fast assembly in production environments. --- ### 5. Summary of Part Number Suffixes * **07:** Represents the specific fin geometry/series. * **D:** Relates to the material/thermal performance tier. * **01:** Dimensional code (40x40mm). * **C1:** Refers to the attachment kit (Plastic push-pin + Spring). * **R0:** RoHS compliance status (lead-free).