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  • ATS-07D-102-C3-R0

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    The **ATS-07D-102-C3-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS) as part of their **pushPIN™** series. This component is designed to provide thermal management for electronic components like CPUs, GPUs, and power modules. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 35mm | | **Fin Pattern** | Straight Fin | | **ROHS Status** | Compliant | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the cooling performance and physical traits: * **ATS-07**: Series designation. * **D**: Material/Finish type (Aluminum with Blue Anodized finish). * **102**: Specific fin geometry and physical dimensions. * **C3**: Indicates the Thermal Interface Material (TIM) pre-applied (usually high-performance T766). * **R0**: Version/Revision number. --- ### 3. Electronic Design Considerations #### Thermal Management The primary electronic role of this part is to dissipate heat. It features a high-density fin structure to increase surface area, allowing for efficient heat transfer from the semiconductor to the ambient air. #### Mechanical Integration Unlike adhesive-based heat sinks, the **pushPIN™** system uses two mounting holes on the PCB. This provides: 1. **Uniform Pressure:** Ensures consistent contact with the electronic component. 2. **Vibration Resistance:** Securely locks the heat sink in place for industrial or mobile electronics. 3. **Ease of Assembly:** Can be installed or removed quickly without specialized tools. #### Electrical Insulation The **Blue Anodized** coating is not just for aesthetics; it provides a thin layer of electrical insulation, which helps prevent accidental short circuits if a metal tool or conductive debris touches the sink during operation. --- ### 4. Typical Applications * **Networking Equipment:** Routers and switches. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs. * **Embedded Systems:** Industrial PCs and controllers. ---
    ✨ Follow-up Questions
    • ⤷ What are the different types of Thermal Interface Materials (TIM) used in the C3 series?
    • ⤷ How do I calculate if the 5.30°C/W resistance is sufficient for my specific CPU?
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?