The **ATS-07D-115-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Dimensions** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 5.33°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | XCUT (Fine pitch for multidirectional airflow) | | **TIM (Interface Material)** | T766 (Pre-applied thermal grease) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting style: 1. **ATS-07**: Refers to the specific series of the product. 2. **D**: Indicates the fin geometry/density category. 3. **115**: Internal code for specific dimension sets (40mm square base). 4. **C2**: Refers to the material and finish (typically aluminum with a blue anodized coating). 5. **R0**: Version/Revision code (Standard). --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not use electricity), it is critical for the electronic health of a system: * **Thermal Dissipation:** It increases the surface area of the component it is mounted on, allowing heat to transfer into the surrounding air more efficiently. * **Multidirectional Airflow:** The **XCUT** fin design allows air to move through the sink from any direction, making it ideal for compact enclosures where airflow might be irregular. * **Pressure-Based Mounting:** The push-pin mechanism ensures constant, even pressure on the chip surface, which is vital for the thermal interface material (TIM) to work correctly. --- ### 4. Application Use Cases This specific size (40mm) and height (20mm) is commonly used for: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGA** (Field Programmable Gate Arrays) in industrial equipment. * **Embedded Systems** and Single Board Computers (SBCs). * **Network Switches** and high-speed routers.