The **ATS-07D-125-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Unducted)** | 8.92 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.93 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 30.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting style: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **07**: Series designation (pushPIN™ system). * **D**: Thermal performance category. * **125**: Dimensional code (Refers to specific length/width combinations). * **C2**: Indicates the material/finish (Aluminum with Blue Anodized finish). * **R0**: Version or Revision code. --- ### 3. Key Electronic Functions While the heat sink itself is a passive mechanical part, its role in an electronic circuit is critical: 1. **Thermal Dissipation**: It increases the surface area of the heat-generating component using a "fine pitch" fin design, allowing air to carry away heat more efficiently. 2. **Attachment Security**: The "pushPIN™" system uses a flexible attachment mechanism that provides precise pressure, ensuring optimal contact between the heat sink and the chip without damaging the PCB. 3. **Thermal Interface (TIM)**: The part comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 4. Application Use-Cases This specific heat sink is typically used in the following electronic environments: * **Networking Equipment:** High-speed routers and switches. * **Industrial Controls:** Power modules that generate significant heat. * **Embedded Computing:** Single-board computers requiring reliable cooling in tight spaces.