The **ATS-07D-131-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Key Specifications The technical specifications of this part define its cooling efficiency and physical compatibility. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-07D-131-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 60mm x 60mm x 20mm | | **Thermal Resistance** | 3.60°C/W (at 200 LFM) | | **Finish** | Blue Anodized | --- ## 2. Technical Components The "Electronic Parts" aspect of this assembly involves several mechanical-to-electrical interfaces: ### A. The Heat Sink Body Constructed from **Aluminum 6063**, the body uses high thermal conductivity to draw heat away from the silicon die. The blue anodized finish is not just aesthetic; it provides surface protection and slightly increases emissivity for better radiation heat transfer. ### B. pushPIN™ Attachment System Instead of simple adhesive tape, this part uses a **pushPIN™ system**. This is critical for electronic stability because: * It ensures consistent **Pressure (Load)** on the processor. * The built-in springs allow for thermal expansion/contraction without cracking the PCB. * It provides a secure mechanical vibration-resistant mount. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the factory-applied TIM. In this case, it usually comes with **T766** or a similar high-performance phase-change material applied to the base, which fills microscopic air gaps between the component and the heat sink. --- ## 3. Thermal Performance Metrics In electronics, cooling is measured by thermal resistance ($R_{th}$). Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 4.60 | | 300 (Unducted) | 2.50 | | 500 (Unducted) | 1.90 | --- ## 4. Summary of Use This part is typically used in **Networking, Telecommunications, and Industrial Computing**. Its 60mm footprint makes it ideal for large-format Integrated Circuits (ICs) that require active or passive airflow within a chassis.