The part number **ATS-07D-132-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 70mm x 70mm x 25mm | | **Thermal Resistance** | 2.66°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Fin Style** | maxiFLOW (Tapered) | | **Base Type** | Flat | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical build: * **ATS-07**: Series designation (Standard heat sink series). * **D**: Thermal resistance characteristic or specific design revision. * **132**: Specific dimension code (Correlates to the 70x70x25mm footprint). * **C2**: Refers to the **Blue Anodized** finish (C1 is usually Gold, C2 is Blue, C3 is Black). * **R0**: RoHS compliance status and packaging revision. --- ### 3. Key Electronic Cooling Features #### **maxiFLOW™ Design** The "maxiFLOW" design features a tapered fin structure. This is engineered to increase the surface area for heat dissipation while reducing the pressure drop of the air flowing through the fins. This makes it highly efficient in "shrouded" or constrained airflow environments. #### **pushPIN™ Attachment** Unlike simple adhesive tapes, this part uses a **pushPIN™** system. * **Mechanism:** It uses a brass or plastic pin with a compression spring. * **Benefit:** It provides a precise, consistent pressure (preload) against the electronic component, which optimizes the thermal interface material (TIM) performance and ensures the sink doesn't shift during vibration. #### **Thermal Interface Material (TIM)** Typically, these units come with a pre-applied phase-change material or high-performance thermal pad on the base to ensure immediate integration onto the PCB. --- ### 4. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or power modules. * **Computing:** Secondary cooling for chipsets or high-end processors on industrial motherboards.