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  • ATS-07D-134-C2-R0

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    The **ATS-07D-134-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for the thermal management of electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 15.00mm | | **Thermal Resistance (Unducted)** | 4.44 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.78 °C/W @ 100 LFM | | **Pitch** | Fine Pitch | | **Pattern** | Cross-Cut | --- ### 2. Key Components & Design The ATS-07D-134-C2-R0 is engineered with several critical electronic packaging features: #### A. Thermal Interface Material (TIM) The part comes pre-assembled with **T766** thermal interface material. This ensures a low thermal resistance interface between the heat source and the heat sink base, maximizing heat transfer efficiency. #### B. pushPIN™ Attachment System Instead of using adhesive tapes or simple clips, this model uses a specialized push-pin system: * **Compression Springs:** Provide precise pressure to ensure consistent contact with the component. * **Brass/Plastic Pins:** Available in different lengths to accommodate various PCB thicknesses. #### C. Cross-Cut Fin Design The fin geometry is "Cross-Cut," which allows for multi-directional airflow. This is particularly useful in dense electronic enclosures where air may not flow in a perfectly linear path. --- ### 3. Usage Context In electronic design, this part is typically used for: * **High-power ASICs:** Cooling custom chips in networking gear. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (15mm height). * **Power Electronics:** Managing heat in voltage regulators or power modules. ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of push-pin mounting over thermal tape?
    • ⤷ How does 'ducted' vs 'unducted' airflow affect the thermal resistance of this part?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound?