ATS-07D-134-C2-R0
AI

The **ATS-07D-134-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for the thermal management of electronic components such as CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 15.00mm |
| **Thermal Resistance (Unducted)** | 4.44 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.78 °C/W @ 100 LFM |
| **Pitch** | Fine Pitch |
| **Pattern** | Cross-Cut |
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### 2. Key Components & Design
The ATS-07D-134-C2-R0 is engineered with several critical electronic packaging features:
#### A. Thermal Interface Material (TIM)
The part comes pre-assembled with **T766** thermal interface material. This ensures a low thermal resistance interface between the heat source and the heat sink base, maximizing heat transfer efficiency.
#### B. pushPIN™ Attachment System
Instead of using adhesive tapes or simple clips, this model uses a specialized push-pin system:
* **Compression Springs:** Provide precise pressure to ensure consistent contact with the component.
* **Brass/Plastic Pins:** Available in different lengths to accommodate various PCB thicknesses.
#### C. Cross-Cut Fin Design
The fin geometry is "Cross-Cut," which allows for multi-directional airflow. This is particularly useful in dense electronic enclosures where air may not flow in a perfectly linear path.
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### 3. Usage Context
In electronic design, this part is typically used for:
* **High-power ASICs:** Cooling custom chips in networking gear.
* **Embedded Systems:** Industrial PCs where vertical clearance is limited (15mm height).
* **Power Electronics:** Managing heat in voltage regulators or power modules.
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- ⤷
What are the advantages of push-pin mounting over thermal tape?
- ⤷ How does 'ducted' vs 'unducted' airflow affect the thermal resistance of this part?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?