The **ATS-07D-148-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Pitch (Fin Spacing)** | COARSE-PITCH | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Physical Design and Functionality #### Heat Sink Geometry * **Fin Type:** This model uses a **Straight Fin** design optimized for **Coarse-Pitch** airflow. This makes it ideal for environments where there is moderate air movement provided by a cooling fan. * **Thermal Conductivity:** Made from Aluminum 6063, which provides an excellent balance between structural rigidity and thermal dissipation efficiency. #### Attachment Mechanism (Push-Pin) * **Components:** Uses a plastic or brass push-pin with a stainless steel spring. * **Function:** The push-pin is inserted through pre-drilled holes in the PCB. The spring provides consistent pressure, ensuring maximum contact between the heat sink base and the electronic component. #### Thermal Interface Material (TIM) * The **T412** coating is pre-applied to the base. This is a high-performance thermal pad/paste that fills microscopic air gaps between the chip and the heat sink to reduce thermal resistance. --- ### 3. Thermal Performance Indicators Thermal performance is measured by the temperature rise over the ambient environment per watt of power ($\Delta T / W$). | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **@1.0 m/s (200 LFM)** | 4.90 °C/W | | **@2.0 m/s (400 LFM)** | 2.73 °C/W | | **@3.0 m/s (600 LFM)** | 2.09 °C/W | --- ### 4. Summary of Use Cases * **Microprocessors/BGA Components:** Used on chips measuring roughly 30mm to 35mm. * **Telecommunications:** Cooling of line cards and networking switches. * **Embedded Systems:** Industrial PCs where vibration resistance (provided by the push-pin) is necessary.