ATS-07D-164-C2-R0
AI

The **ATS-07D-164-C2-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for localized cooling of Integrated Circuits (ICs).
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-07D-164-C2-R0 |
| **Heat Sink Type** | Push Pin (Spring-loaded) |
| **Material** | Aluminum (Blue Anodized) |
| **Fin Style** | Square Fin (Cross-cut) |
| **Dimensions** | 45mm x 45mm x 33mm |
| **Thermal Resistance** | 2.41°C/W (at 200 LFM) |
| **Attachment Method** | Plastic Push Pin with Brass Spring |
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### 2. Key Electronic Functions
This component serves a critical role in thermal management for electronic systems:
* **Thermal Dissipation:** It increases the surface area of a heat-generating component (like a CPU, GPU, or FPGA), allowing the ambient air to carry away heat more efficiently.
* **Active vs. Passive Cooling:** While the sink itself is passive, its "Cross-cut" fin design is optimized for **forced-air environments** (systems with internal fans), allowing air to move through the fin array from any direction.
* **Pressure Management:** The "R0" version uses a specific spring tension to ensure the heat sink maintains constant pressure against the chip, which is vital for maintaining the effectiveness of the Thermal Interface Material (TIM).
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### 3. Physical Design Components
1. **The Base:** Flat aluminum surface that makes contact with the electronic chip.
2. **The Fins:** High-density square pins that maximize the "Surface Area to Volume" ratio.
3. **Push Pins:** Two plastic pins that snap into pre-drilled holes on a PCB (Printed Circuit Board).
4. **Springs:** Provides the necessary downward force (mechanical load) to keep the sink stable during vibration or thermal expansion.
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### 4. Typical Applications
* **Networking Hardware:** Routers, switches, and gateways.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Supplies:** Cooling high-wattage voltage regulators.
- ⤷
What is the difference between the C1 and C2 versions of ATS heat sinks?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this heat sink?
- ⤷ What type of Thermal Interface Material is recommended for the ATS-07D series?