The **ATS-07D-171-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for the cooling of electronic components, specifically integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | | **Thermal Resistance** | 7.33°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Shape** | Square (Straight Fin) | | **Base Type** | Flat | --- ### 2. Key Electronic Features While the heat sink itself is a passive mechanical part, its design is engineered for specific electronic environments: * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a brass pin and a stainless steel spring. This ensures a precise, high-pressure fit against the electronic chip, which optimizes the thermal interface material (TIM) performance. * **Straight Fin Design:** The fins are aligned to allow airflow to pass through efficiently. It is optimized for **forced air cooling** environments (where fans are present). * **Blue Anodized Coating:** The anodization is not just for aesthetics; it provides surface protection and slightly increases emissivity, which aids in radiant heat transfer. * **Thermal Performance Curve:** The efficiency of this part is highly dependent on airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** ~7.33°C/W * **High Airflow (800 LFM):** ~2.90°C/W --- ### 3. Compatible Application Areas This part is commonly found in the following electronic assemblies: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** For industrial motherboards where vertical space is limited to 20mm. 3. **Power Supplies:** Cooling MOSFETs or power ICs. 4. **Telecommunications:** Used in base stations where high reliability is required. --- ### 4. Part Number Breakdown ```text ATS - 07 D - 171 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface Material/Color (Blue Anodized) | | +-------------- Part ID (Dimensions/Fin Profile) | +-------------------- Fin Pitch/Series (pushPIN Series) +-------------------------- Manufacturer (Advanced Thermal Solutions) ```