The **ATS-07D-182-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Push Pin | | **Attachment Method** | Push Pin (Spring loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Off Base)** | 15.00 mm | | **Thermal Resistance** | 7.48°C/W (Unducted flow @ 100 LFM) | --- ### Key Components & Design Features #### 1. Heat Sink Body (Fine Pitch) The part utilizes a **straight-fin** design. This is optimized for systems with consistent airflow. The aluminum construction provides a high strength-to-weight ratio and excellent thermal conductivity. #### 2. pushPIN™ Attachment Unlike adhesive-based heat sinks, this uses a **mechanical push-pin system**. * **Springs:** Ensure precise, uniform pressure across the component interface. * **Stability:** Provides a secure fit that resists vibration and mechanical shock better than thermal tape. #### 3. Pre-Applied Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with a **pre-applied Thermal Interface Material**. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a consistent layer for optimal heat transfer. #### 4. Blue Anodized Finish The surface is treated with an anodic oxide finish. While primarily aesthetic, it also provides: * Increased corrosion resistance. * Electrical insulation of the surface. * Slightly improved emissivity for radiant cooling. --- ### Usage Guidelines * **Application:** Best suited for 40mm x 40mm chipsets. * **Airflow Requirements:** Performance varies significantly based on Linear Feet per Minute (LFM). At 100 LFM, the resistance is **7.48°C/W**, but it drops to approximately **2.25°C/W** at 700 LFM (high airflow). * **PCB Mounting:** Requires specific hole patterns on the PCB for the push-pins to lock into.