## Overview of ATS-07D-199-C3-R0 The **ATS-07D-199-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** line, designed for efficient heat dissipation in electronic assemblies, particularly for CPUs, GPUs, and power semiconductors. --- ### Technical Specifications | Feature | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flow)** | 15.95 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.50 °C/W @ 700 LFM | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm | | **Pitch** | Fine Pitch | | **TIM (Interface Material)** | T412 (Phase Change) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Aluminum) The core component is a 50x50mm aluminum block with a **Fine Pitch** fin pattern. The low profile (6mm height) makes it suitable for space-constrained electronic enclosures where vertical clearance is limited. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical spring-loaded pin system. * **Springs:** Ensure consistent pressure between the heat sink and the electronic component. * **Hardware:** Usually consists of brass or plastic pins that lock into pre-drilled holes on the PCB. #### 3. Thermal Interface Material (TIM): T412 The "C3" in the part number indicates the specific thermal pad applied to the base. **T412** is a high-performance phase-change material that melts at operating temperatures to fill microscopic air gaps between the component and the heat sink, maximizing heat transfer. #### 4. Blue Anodized Finish The surface is chemically treated to provide corrosion resistance and increased surface emissivity. In electronics, the blue color often signifies specific thermal properties or product series within the ATS catalog. --- ### Application in Circuit Design This part is typically used for cooling: * **Integrated Circuits (ICs):** Large FPGAs or ASICs. * **Voltage Regulators:** High-current power modules. * **Embedded Systems:** Industrial PCs where active fan cooling is not feasible or must be supplemented by passive dissipation.